FOWLP is one of the most advanced microelectronic packaging technologies, offering numerous advantages over traditional packaging technologies such as superior electrical and thermal performance, lower inductance, lower thermal resistance, lower power consumption and lower cost, enabling high performance multichip, system-in-package and heterogeneous integration.

"With the help of this FFG grant, SAL can conduct research, development, and manufacturing of wafer-level packages based on FOWLP for a variety of applications in RF, MEMS, and power electronics, including mobile and consumer electronics, Radar, 5G / 6G, high-performance computing, data centres, medical devices, autonomous vehicles, and advanced sensors," explains Dr. Ali Roshanghias, Head of the Research Unit for Heterogeneous Integration Technologies. 

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Senior Scientist - Fan out wafer level packaging