Advanced Wafer Level Technologies

Photo: © Infi­neon Tech­nolo­gies Austria AG

Objective

To create a powerful model­ling and MEMS design toolbox for advanced wafer level MEMS inte­gra­tion in order to improve:

• Next gener­a­tion of Tire-Pres­sure Moni­toring System (TPMS) sensors
• Inno­v­a­tive design and micro­fab­ri­ca­tion tech­nolo­gies of MEMS devices
• Wafer level inte­gra­tion process

The main chal­lenges and topics of inves­ti­ga­tion are:

• Model­ling the influ­ence of anodic bonding process on Tire-Pres­sure Moni­toring System
• Model­ling the charge distri­b­u­tion in and on the struc­tured glass wafer
• Model­ling sensi­tivity of elec­trical charges on piezo-resis­tive accelerom­eter MEMS struc­tures
• Predict influ­ence of wafer level MEMS tech­nolo­gies on any future TPMS design

Expected Results

• Predict influ­ence of wafer level tech­nolo­gies on TPMS sensors
• Influ­ence of anodic bonding process on  TPMS MEMS next gener­a­tion design
• Advanced simu­la­tion tool for wafer level MEMS inte­gra­tion
• Improve­ment of wafer level process tech­nolo­gies