Advancing 3D and 2.5D wafer-level integration by developing novel PVD technologies and materials for the fabrication of TSV interposers and hybrid-bonded wafers.
ADVANCED PACKAGING TECHNOLOGIES VIA NOVEL SPUTTERING
Partner Call open until: 31.08.2026
Project Start: 01.10.2026
- To develop and evaluate processes for the fabrication of TSVs with medium to high aspect ratios
- To investigate low-temperature hybrid bonding using novel fabrication processes and materials
Expected results
- Research and development of low temperature Hybrid bonding process below <250 °C
- Demonstration of Hybrid bond test vehicles with novel materials and fabrication process
- Demonstration of TSV interposer with medium to high aspect ratios with novel PVD processes
