UWBG

Partner Call open until: 06.08.2026

Project Start: Mid-August 2026

To test the performance of novel ultra-wide bandgap materials in power devices by:

• Simulation of electrical field distribution in power devices
• Process development of metallic and dielectric layers incl. deposition (evaporation, sputtering, atomic layer deposition) and etching
• Investigation of influence of surface treatments
• Fabrication of diode and transistor demonstrators
• Testing of demonstrator devices

• Optimized device design based on simulations
• Single and full flow process optimizations regarding deposition, etching, and lithography
• Two generations of demonstrator devices
• Benchmark of device based on novel ultra-wide bandgap material against device based on conventional wide bandgap material