PMICS

The designed power module offers an all-in-one solution, integrating the latest direct copper-bonded power semiconductors along with gate driving circuits and current sensing capabilities. By using a standard PCB and off-the-shelf components, the module provides both flexibility and cost advantages for small-to-medium production volumes.

The EZ232L (https://www.akm.com/eu/en/about-us/news/2025/20250411-ez232/) – a linear Hall-effect IC from AKM – enables coreless current sensing with high resolution and accuracy, supporting improved efficiency in traction inverters operating over a wide current range. Using the PCB substrate allows for sensor placement to both provide robust current measurement and wide bandwidth.

The use of top-side-cooled (QDPAK) semiconductor devices, combined with a flexible PCB substrate, allows for an exceptionally low loop inductance of approximately 5 nH. A two-sided cooling approach enables a compact footprint, even with the integration of gate drivers and sensors, while maintaining adequate thermal performance for high-power applications. This is made possible by effective heat spreading through the QDPAK heat slugs.

Additionally, this cooling concept resolves the typical planarity issues associated with top-side cooling, as the assembly is clamped between two cooling plates.

By integrating control and gate electronics in close proximity to the power devices, the PCB-based design supports robust and reliable commutation – even at very high current levels.